To address diverse applications, the 3B Subsystem Series was designed to provide a complete signal conditioning solution. The 3B03 is designed for 4 channels to offer users the flexibility to match the size of a system to specific applications. All backplanes are provided with #6-32 x 1-inch screws and standoffs for mounting. Several mounting options are available, including rack, surface and NEMA enclosure. All 3B Series modules feature a universal pin out and can be easily tailored to fit the user's application. Each backplane can accommodate any 3B Series module in a "Mix and Match" arrangement. Modules are "Hot Swappable"; power does not have to be removed when inserting or removing any module on the backplane. All backplanes provide a four screw terminal for each individual channel's input field connections. These connections satisfy all transducer inputs and provide transducer excitation when necessary. A cold junction temperature sensor is also supplied on each channel to accommodate thermocouple input modules. Each channel has two screw terminals for the output connections for the 4-20 mA output signal. Two 26-pin system connectors provide high level voltage I/O for all channels. * Mix and Match 3B Series I/O Module Capability * Factory Mutual (FM) Approved * CE Certified * ±1500 V peak Channel/Channel and Input/Output Isolation