Improve the Heat Transfer between a CPU and Heatsink through a Ceramic/Silicone Compound -Ceramic-based compound containing silicone -Thermal conductivity of more than 1.066 W/m-K The HEATGREASE20 CPU Thermal Paste Compound can be used to improve the effectiveness of a CPU cooler, by thermally bonding the surface of the CPU to the heatsink, which enables the heatsink and fan to work more efficiently to remove harmful heat from the CPU. This 20g tube of ceramic-based thermal grease is enough for a large number of CPU installations for most home or business computers or any other light application where good thermal bonding between two surfaces is required. Please see our support section for the Material Safety Data Sheet for HEATGREASE20.