Provide optimal heat transfer between CPU and heatsink through a metal oxide compound -Metal-based compound containing metal oxide -Thermal conductivity of more than 1.93 W/m-K -Negligible electrical conductivity -Stable performance over a wide temperature range -4-6 applications per tube Our thermal CPU paste improves the effectiveness of CPU coolers by thermally bonding the CPU to the heatsink. A high quality metallic solution that helps to ensure maximum dissipation of heat generated by the CPU for optimized performance and greater system stability; and is more effective than standard silicon-based heat grease/CPU paste, providing optimum protection against CPU heat damage. Please see our support section for the Material Safety Data Sheet for SILVGREASE1.