10051229 Aluminium Minute Adhesive, 24 ml
reichelt elektronik
RSS
14.46 EUR61.69 PLN
- Sklep zagraniczny
- MPN:
- 10051229
- Kod:
- 279927
- Producent:
- Weicon
- GTIN-13:
- 4024596061050
- Waluta:
- euro
- Dodany do bazy:
- Ostatnio widziany:
- Zmiana ceny:
- +8% (17.04.2025)
- Poprzednia cena:
- 13.39 EUR
Sugerowane produkty dla soiling
WEICON Aluminium Minute Adhesive is an odourless, two-component epoxy adhesive filled with aluminium. It cures fast at room temperature and practically without shrinkage. After curing, the adhesive can be machined (filing, drilling, milling). Aluminium Minute Adhesive is gap-filling and non-dripping (thixotropic) and shows very high tensile, impact and peel strength.
The adhesive is particularly suitable for bonding aluminium and other light metals. It can be used for filling cracks and holes on aluminium housings, for example, and for repairing light alloy wheels.
In order to achieve optimal adhesion, the bonding surfaces should be dry and free from grease or soiling. Scraping or sanding the surfaces before cleaning also improves adhesion.
Elecena nie prowadzi sprzedaży elementów elektronicznych, ani w niej nie pośredniczy.
Produkt pochodzi z oferty sklepu reichelt elektronik