The multi-chip LIN System-in-Package (SiP) is designed for LIN-bus node applications, supporting highly integrated solutions for in-vehicle LIN networks. The first LIN-system-basis-chip (LIN-SBC), ATA6624 has an integrated LIN transceiver, 5V regulator and window watchdog. The second chip contains the Microchip AVR ATtiny167 8-bit automotive microcontroller with advanced RISC architecture with 16 Kbytes of flash memory. All pins of the LIN-SBC and AVR microcontroller are bonded out to provide customers the same flexibility for their applications as they do with discrete devices.