Easy Print NO CLEAN Low Temperature Solder Paste Sn96.5/Ag3/Cu0.5 1.4ml Syringe

Paste designed for soldering SMD components in production processes that do not include washing phase. It is based on a ‘no clean’ flux type, that does not require cleaning and its residues do not cause corrosion centres. The product cooperates with all the lead free alloys, it exhibits good tackiness and wettability of soldered surface. It does not lose its physical and chemical properties even after being left for 20 hours on the PCB. This time depends on conditions in room: humidity and temperature.

No Clean Soldering Paste

Sn96.5 Ag3 Cu0.5

Description:

Paste for soldering of surface-mounted (SMD) components

Advantages:

Resistant to solderballing ( mid chip solderballing )

Good adhesion to components for over 24hrs after application

Exhibits long stencil life even for 8hrs of continuous printing, prolonged usability ( stencil life )

Low level of colorless, non-corrosive soldering residues ( no clean ), that are flexible enough to allow penetration of tester needles

Fine pitch

Printing with squeegee speed up to 150mm/s