The MPV series of surface mount varactor diodes utilize a unique new monolithic fabrication technology. This technology employs package / device integration accomplished at the wafer fabrication level. Since the cathode and anode interconnections utilize precision photolithographic techniques rather than wire bonds, parasitic package inductance is minimized and tightly controlled. The package parasitics provide smooth non-resonant functionality through 8 GHz. These devices are available in tap on reel format as well as in expanded sawed wafers on Mylar film frames for low cost automatic insertion. The series of diodes meets RoHS requirements per EU Directive 2002/95/EC.