This ultrafast rectifier in the dual flag SO−8 flat lead package offersdesigners a unique degree of versatility and design freedom. The twodevices are electrically independent and can be used separately, ascommon cathode, as common anode or in series as a function of board level layout. The exposed pad design provides low thermal resistance. The clip attach design creates a package with very efficient die size to board area ratio. While thermal performance is nearly the same as the DPAK package height and board footprint are less than half.