This thermal conductive pad by Delock is suitable for heat dissipation, for example, on an M.2 module. The goal of the pad is to improve performance and increase the service life of the components. Technical details https://elecena.pl/product/29322828/18473-thermal-pad-3-0-w-mk-70-x-20-x-0-75-mm 2025-09-01 https://elecena.pl/product/29322828/18473-thermal-pad-3-0-w-mk-70-x-20-x-0-75-mm 2026-02-26