High performance - very soft Based on silicone and a special filler, the TP-3 outperforms high-performance pads, especially in the case of height differences of closely spaced chips that typically occur due to manufacturing tolerances. The TP-3 offers excellent thermal conductivity despite its extremely low hardness. Minimisation of thermal resistance The thinner the pad, the lower the thermal resistance. The TP-3 pad with a thickness of 0.5 mm can easily be compressed to 0.3 mm, thus compensating for height differences between various components of up to 0.2 mm. Please note that due to the extremely low hardness, the installation of the 0.5-mm pad requires extra care. Please refer to the user manual.