Infineon’s AIROC™ CYBT-353027-02 is a fully certified Bluetooth® Smart Ready wireless embedded module based on a proven hardware design and Infineon’s AIROC™ CYW20706 silicon device. This module is ideal for applications requiring an extended temperature operation of up to +105o C. The CYBT-353027-02 includes a royalty-free BLE stack compatible with Bluetooth® 5.0 in a 9.0 × 9.0 × 1.75 mm SMT package form-factor, with a PCB Trace antenna.