The P-MCS8-2-1 is a economical thin module (< 250µm) allowing: integration of additional security layer, possibility of very thin inlays, additional layer to reduce card cracks, higher card quality (more coverage over chip). It uses the proven lead frame design from the P-MCC8-2-6. With its standard dimensions and due to its compatible design existing sets of production settings e.g. for thermo compression can be used and allow a easy change over.