The LTM®3360B is a high-current, high-density, lowvoltage buck power μModule® (micromodule) regulator optimized for high-output current applications. The 2.9V to 5.5V input voltage range accommodates an intermediate bus voltage (IBV) of 5V ±10% or 3.3V ±10%. The current output capability of 33A can be paralleled to provide >1000A in a multiphase, stacked from a main-tosubordinate device configuration. Regulated output voltages down to 0.3V are achieved using a current mode architecture, which is capable of small on-time at very high frequencies. Select an appropriate feedback resistor divider to configure the output voltage. The 0.3V (default) feedback voltage is 8-bit adjustable through an I2C for margining or dynamic voltage scaling. Keep the feedback voltage close to 0.3V for the best phase-margin voltage regulation loop. The high fixed clock frequency of 5MHz which is double the switching frequency of 2.5MHz each phase permits integration of input and output capacitors and a power inductor, resulting in the highest density of output current-to-board footprint achievable in the industry today with minimal external components required. The LTM3360B is offered in a ball grid array (BGA) package, 0.4mm ball pitch, with excellent thermal performance and integrated inductors, input, and output capacitors. The LTM3360B is lead(Pb)-free and RoHS-compliant. APPLICATIONS * Data Centers xPU Core, Application-Specific Integrated Circuit (ASIC), Field-Programmable Gate Array (FPGA) Supplies * Optical Modules * Industrial and Communications * Distributed DC Point-of-Load (POL) Power Systems * Highest Output Current to Total Solution Footprint (1A/mm2), Integrates all CINs, COUTs, and Inductors * Fast Transient Response * VIN Range: 2.9V to 5.5V * VOUT Range: 0.3V to 1V * Remote Differential Output Sense Pins * VOUT + DC accuracy: ±1% * I2C Serial Interface—Telemetry Readback Includesm VOUT, IOUT, VIN, and Die Temperature