Solder Paste CR 22 - Soldering SMT Components - Lead-Free Soldering with 3 Metals - With water-soluble flux, it allows for easy cleaning without introducing additional chemicals onto the circuit board Our CR 22 solder paste is ideally suited for all SMD applications. The otherwise time-consuming process of soldering SMT components becomes a quick and easy step when using CR 22 solder paste. The flux composition complies with F-SW 33 or, according to the new standards, RE L0. This is a water-soluble flux whose residues can be easily removed with water after soldering. No additional chemical materials are required on the printed circuit board. Residues should always be removed. The lead-free solder alloy contains 96.5% Sn, 0.5% Ag, and 0.5% Cu. Qualification: CR 22 solder paste is a water-soluble paste. It has passed the relevant corrosion, solder ball, and wetting tests, as well as the contour stability test. Residues must be removed from the printed circuit board. Advantages: