CR 22 Solder Paste - Soldering SMT Components - Lead-Free Soldering with 3 Metals - With water-soluble flux, it allows for easy cleaning without spreading chemicals onto the circuit board Our CR 22 solder paste is ideally suited for all SMD applications. The otherwise time-consuming process of soldering SMT components with lead-free solder wire is transformed into a quick and easy operation through the use of CR 22 lead-free solder paste. Its development is based not only on many years of experience in the SMD field but also on careful and strict adherence to the guidelines of DIN, SN, IPC, and MIL standards. The flux composition complies with F-SW 33 or, according to the new standards, RE L0. This is a water-soluble flux whose residues can be easily removed with water after soldering. No additional chemical materials are required on the printed circuit board. The residues should always be removed. The lead-free solder alloy contains 96.5% Sn, 0.5% Ag, and 0.5% Cu. Qualification: CR 22 solder paste is a water-soluble paste that meets the highest requirements. It has passed the relevant corrosion, solder ball, and wetting tests, as well as the contour stability test. Residues must be removed from the printed circuit board. Advantages: