The SN74LVC1G11 performs the Boolean function Y = A • B • C or Y = A\ + B\ + C\ in positive logic. NanoFree™ package technology is a major breakthrough in IC packaging concepts, using the die as the package. This device is fully specified for partial-power-down applications using Ioff. The Ioff circuitry disables the outputs, preventing damaging current backflow through the device when it is powered down.