elecena.pl

Hongshang HRA3 15/4 Heatshrink + Adhesive Black 3:1 1.22m

Rapid Electronics

The Hongshang HRA3 15/4 heatshrink with adhesive has a shrinkage ratio of 3:1, reducing from 15 mm to 4 mm. Its heat-activated adhesive lining provides a secure and waterproof seal. Typical applications include electrical insulation, wire bundling, and protection from environmental elements.

Elecena nie prowadzi sprzedaży elementów elektronicznych, ani w niej nie pośredniczy.

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