18481 Heat conduction pad, 3.0 W/mk, 120 x 20 x 0.5 mm, Silicone free

This thermal conductive pad by Delock is suitable for heat dissipation, for example, on an M.2 module. The goal of the pad is to improve performance and increase the service life of the components. Typical areas of application for silicone-free pads can be found in industry and optoelectronics.

Non-silicone Silicone-free pads do not release any oils that could contaminate or damage sensitive components. This makes them ideal for sensitive electronics such as sensors. Silicone-free pads can also be used in a wider temperature range without compromising their properties, which is particularly useful in industrial applications with extreme temperatures. In addition to the advantage of longer durability, they are also more environmentally friendly than conventional thermal pads.

Technical details