TG-PS-50-40 PhaseSheet PTM, 50x40 mm

The phase-change material on which PhaseSheet PTM is based is solid at room temperature. The material begins to liquefy only at temperatures above 45 degrees Celsius. To ensure optimal distribution of the liquid PhaseSheet PTM and thereby achieve the thinnest possible layer thickness, a high contact pressure of approximately 300-400 N is required. In its liquid state, PhaseSheet PTM has very low viscosity and contracts again as it transitions back to a solid state, which mitigates the pump-out effect.

The pump-out effect is particularly pronounced when a copper heatsink is combined with a graphics chip because silicon and copper have different coefficients of thermal expansion. Under load, the heat spreader and the base plate deform (becoming concave or convex) due to the temperatures and return to their original shape (straight) as they cool. As a result, the thermal paste is slowly squeezed out, for example, between the heat spreader and the base plate of the CPU cooler.

With the PhaseSheet PTM, maximum thermal conductivity develops and stabilizes after approximately ten thermal cycles, each lasting 60 degrees Celsius.

Key Facts