S-COM8.4

The innovative ’Coil on Module’ package technology from Infineon uses a radiofrequency link rather than the common mechanical-electrical connection between the card antenna and the module, it employs two antennas, one on the module and one in the card, communicating w/o physical electrical connection.It improves the robustness of dual interface cards and simplifies card design and manufacturing, making it more efficient and faster.