CYBLE-416045-02

Infineon’s AIROC™ CYBLE-416045-02 is a fully certified Bluetooth® LE module based on Infineon’s PSOC™ 63 MCU with AIROC™ Bluetooth® LE. This embedded module includes a royalty-free Bluetooth® stack compatible with Bluetooth® Core5.0 and is available in 14 x 18.5 x 2.00 mm SMT form-factor and is certified to FCC, ISED, MIC, and CE regulations.

CYBLE-224116-01

CYBLE-012011-00

CYBLE-014008-00

CYBLE-212006-01

Infineon’s AIROC™ CYBLE-212006-01 is a fully certified Bluetooth® LE embedded module based on Infineon’s PSOC™ 4-BLE. This module includes a royalty-free Bluetooth® stack compatible with Bluetooth® Core 5.1, reducing the additional time needed for design, development and certification. It is available in 14 x 18.5 x 2.00 mm SMT form-factor and is certified to FCC, ISED, MIC, and CE regulations.

CYBLE-214015-01

Infineon’s AIROC™ CYBLE-214015-01 is a fully certified Bluetooth® LE embedded module based on Infineon’s PSOC™ 4-BLE. This module includes a royalty-free Bluetooth® stack compatible with Bluetooth® Core 5.1, reducing the additional time needed for design, development and certification. It is available in 11 x 11 x 1.70 mm SMT form-factor, with a PCB trace antenna and is certified to FCC, ISED, MIC, and CE regulations.

CYBLE-212020-01

CYBLE-222014-01

CYBLE-333073-02

Infineon’s AIROC™ CYBLE-333073-02 is a fully certified Bluetooth® LE module based on Infineon’s CYW20835. This embedded module includes a royalty-free Bluetooth® stack compatible with Bluetooth® 5.0 and is available in 13.31 x 21.89 x 1.95 mm SMT form-factor. This module complies with Bluetooth® Core 5.2 and has gone through Qualification with Required Testing path with Declaration ID D056777 and QDID 176091.

CYBLE-022001-00