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    FF1300UXTR23T2M1P

    CoolSiC™ MOSFET half-bridge module 2300 V XHP™ 2 CoolSiC™ MOSFET 2300 V, 1.3 mΩ module with half-bridge topology, robust .XT interconnection technology for enhanced lifetime with best in class reliability and with pre-applied Thermal Interface Material (TIM).
    Producent:
    Infineon
    Rozmiar:
    987 kB
    Stron:
    17
  2. Podgląd PDFa
    Do dokumentacji »

    FF1300UXTR23T2M1

    CoolSiC™ MOSFET half-bridge module 2300 V XHP™ 2 CoolSiC™ MOSFET 2300 V, 1.3 mΩ module with half-bridge topology and robust .XT interconnection technology for enhanced lifetime with best in class reliability. Also available with pre-applied Thermal Interface Material (TIM).
    Producent:
    Infineon
    Rozmiar:
    950 kB
    Stron:
    17