Heatsink (Arria10 Package)

iWave Systems FPGA Heat Sinks for SOMs are designed for the FPGA SOMs Arria10 and Zynq Ultrascale+ MPSOC. The FPGA Heat Sinks are available in a 95mm x 75mm package made up of aluminium material. The devices have a silicone elastomer as a thermal gap pad between the CPU and the heat sink. The rugged and light weight heat sinks can be easily attached with the iWave’s FPGA system on modules.

Features & Specs

* 95mm x 75mm Package * Aluminium material * Silicone elastomer as a thermal gap pad * Rugged and light weight * Mounting Style: Screw * Fin Style: Forged Fin