SSAC 2010 Solder wire, lead-free, 0.2 mm, Sn 96.5 Ag Cu0.5 10 gr

The solution for your future soldering needs: lead-free

SSAC 2010 lead-free solder wire with three metals and silver content for Fine Pitch components

Flux-powder as per F-SW 32 -> Barely visible, clear flux-powder residue Not necessary to clean the PCB boards -> NO - CLEAN Eutectic solder, i.e. the solder is either in a solid or liquid state, there is no paste-like transition state -> No bonded solder joints -> Particularly important for the smallest solder joints with minimum solder volume Ideal for use in SMD technology, in particular Fine Pitch components and micro components Sn 96.5 Ag Cu0.5 Silver-containing alloy makes soldering of SMDs and precision connections easier Little smoke is produced

Lower soldering repair temperature compared to conventional lead-free soldering -> Easier to use for users

Melting point: - Solid: 217°C - Liquid: 217°C