SH68N65DM6AG Automotive-grade N-channel 650 V, 35 mOhm typ., 64 A MDmesh DM6 half-bridge topology Power MOSFET in an ACEPACK SMI

This device combines two MOSFETs in a half-bridge topology. The ACEPACK SMIT is a very compact and rugged power module in a surface mount package for easy assembly. Thanks to the DBC substrate, the ACEPACK SMIT package offers low thermal resistance coupled with an isolated top-side thermal pad. The high design flexibility of the package enables several configurations, including phase legs, boost, and single switch through different combinations of the internal power switches.