14V Input, 3A High-Efficiency Buck Converter in WLP or QFN

The MAX77504 is a synchronous 3A step-down DC-DC converter optimized for portable 2-cell and 3-cell battery-operated applications. The converter operates on an input supply between 2.6V and 14V. Output voltage is adjustable between 0.6V and 6V with external feedback resistors. The device features a low-IQ SKIP mode that allows excellent efficiency at light loads. The MAX77504 can be sychronized by driving the FPWM pin with an external clock.

Dedicated enable, power-OK, and FPWM pins allow simple hardware control. The SEL input easily configures switching frequency, gain, and output active discharge option. Built-in undervoltage lockout (UVLO), output active discharge, cycle-by-cycle inductor current limit, thermal shutdown, and short-circuit protection ensure safe operation under abnormal operating conditions.

The MAX77504 is offered in a small 1.7mm x 1.7mm, 16-bump, 0.4mm pitch wafer-level package (WLP) or a 2.5mm x 2.5mm, 12-lead, 0.5mm pitch flip-chip QFN (FC2QFN).

Applications

* 1- to 3-Cell Li+/Li-ion Battery-Powered Devices * Professional Radio, Handheld Computers * Mirrorless Cameras, DSLR, and Notebook Computers * Portable Scanners, POS Terminals, Printers * Space-Constrained Portable Electronics

* 3A Single-Channel Buck Regulator * 2.6V to 14V Input Voltage * 0.6V to 6V Output Voltage Range * 0.5MHz to 1.5MHz Fixed-Frequency Switching Options * High Efficiency, Low IQ Extends Battery Life

* 94% Peak Efficiency at 7.4VIN, 3.3VOUT (2520 Inductor) * 10μA ISUP (12VIN, 1.8VOUT) * OUT Powers VL Automatically (VOUT > 1.7V) for Low IQ

* Enable Pin (EN) for Direct Hardware Control * Extenal Clock Synchronization Is Available Through the FPWM/SYNC Pin * Power-OK Output (POK) Monitors VOUT Quality (See Ordering Information) * Protection Features

* Cycle-by-Cycle Inductor Current Limit * Short-Circuit Hiccup Mode, UVLO, and Thermal Shutdown Protection * Soft-Start

* FC2QFN or WLP Package Option

* 2.5mm x 2.5mm (0.6mm max. height) 12-Lead FC2QFN, 0.5mm Pitch * 1.7mm x 1.7mm (0.7mm max. height) 16-Bump WLP, 0.4mm Pitch, 4 x 4 Array

* All WLP Package Bumps (Except POK) Routeable on a Non-HDI PCB