M5Stamp ESP32S3 Module

The STAMPS3 is a main control core module, using a Lexin ESP32-S3FN8 main control chip, 8MSPI flash memory, an Xtensa 32-bit LX7 dual-core processor and a main frequency up to 240MHz. It has a built-in 5V to 3.3V circuit, an RGB status indicator, a programmable button, and a 1.27MM/2.54MM spacing lead. It supports SMT, DIP row, and DIP row jump wires. The module is suitable for IoT application scenarios with embedded main control modules. We also stock a version with pin headers pre-soldered. Features

* ESP32-S3FN8(2.4GHz Wi-Fi)

* Minimal system board

* Multi-IO lead-out, support multiple application forms (SMT, DIP, flying wire)

* Integrated programmable RGB LEDs and buttons

* Support UIFlow graphical programming

Specifications

Resources Parameters

MCU ESP32-S3FN8

DCDC Highly integrated MUN3CAD01-SC

Flash 8MB

Input voltage 5V

Interactive Programmable physical buttons x 1, programmable RGB LED (WS2812B-2020) x 1

Antenna type 2.4G 3D antenna

Module resource interface Touch sensor, SD/SDIO/MMC master controller, SPI, SDIO/SPI slave controller, EMAC, motor PWM, LED PWM, UART, I2C, I2S, GPIO, pulse counter

IO interface x23

G0/G1/G2/G3/G4/G5/G6/G7/G8/G9/G10/G11/G12/G13/G14/G15/G39 /G40/G41/G42/G43/G44/G46

Connection method SMT/DIP (pitch 2.54mm and 1.27mm)/Jump Wire

IO interface spacing 2.54mm x 1.27mm

Operating temperature 0°C to 40°C

Product Size 26mm × 18mm × 4.6mm

Package Size 136mm × 92mm × 13mm

Product Weight

3.2g

Package Weight

7.5g

Resources

* Product Wiki

Package Contents

* 1x StampS3

* 1x HY2.0-4P terminal

* 1 x 2.54-9P header

* 1 x 2.54-6P header

* 1 x Hex Key

* 1 × User manual