CYBT-413061-02

CYBT-333032-02

Infineon’s AIROC™ CYBT-333032-02 is a fully certified Bluetooth® Smart Ready wireless embedded module based on a proven hardware design and Infineon’s AIROC™ CYW20706 silicon device. This module includes a royalty-free Bluetooth® stack compatible with Bluetooth® Core 5.0. It is available in 12.0 × 15.5 × 1.95 mm package SMT form-factor, with an external -u.FL antenna and is certified to FCC, ISED, MIC, and CE regulations.

CYBT-253059-02

Infineon’s AIROC™ CYBT-253059-02 is a fully certified Bluetooth® and Bluetooth® LE module based on Infineon’s CYW20820. This embedded module is available as a 35-ball package in 11x11x1.7mm SMT form-factor. Infineon’s AIROC™ CYBT-253059-02 module complies with Bluetooth® Core 5.4 and has gone through qualification with a Declaration ID D052875 and QDID158813.

CYBT-343026-01

Infineon’s AIROC™ CYBT-343026-01 is a fully certified Bluetooth® Smart Ready wireless embedded module based on a proven hardware design and Infineon’s AIROC™ CYW20706silicon device. This module includes a royalty-free Bluetooth® stack compatible with Bluetooth® Core 5.0. It is available in 12.0 × 15.5 × 1.95 mm package SMT form-factor, with an external -u.FL antenna and is certified to FCC, ISED, MIC, and CE regulations.

CYBT-213043-02

Infineon’s AIROC™ CYBT-213043-02 is a fully certified Bluetooth® and Bluetooth® LE module based on Infineon’s CYW20819. This embedded module is available in 12 x 16.61 x 1.70 mm SMT form-factor. Infineon’s AIROC™ CYBT-213043-02 module complies with Bluetooth® Core 5.4 and have gone through Qualification with Required Testing path with Declaration ID D043205 and QDID 154138.

CYBT-423060-02

CYBT-263065-02

Infineon’s AIROC™ CYBT-263065-02 is a fully certified Bluetooth® and Bluetooth® LE module based on Infineon’s CYW20819. This embedded module is available in 12.5 x 19 x 1.95 mm SMT form-factor. Infineon’s AIROC™ CYBT-263065-02 module complies with Bluetooth® Core 5.4 and has gone through Qualification with a Declaration ID D051682 and QDID 158431.

CYBT-343151-02

Infineon’s AIROC™ CYBT-343151-02 is a fully certified Bluetooth® Smart Ready wireless embedded module based on a proven hardware design and Infineon’s AIROC™ CYW20706 silicon device. This module is ideal for applications requiring an extended temperature operation of up to +105o C. The CYBT-343151-02 module includes a royalty-free Bluetooth® stack compatible with Bluetooth® Core 5.0.

CYBT-483062-02

CYBT-353027-02

Infineon’s AIROC™ CYBT-353027-02 is a fully certified Bluetooth® Smart Ready wireless embedded module based on a proven hardware design and Infineon’s AIROC™ CYW20706 silicon device. This module is ideal for applications requiring an extended temperature operation of up to +105o C. The CYBT-353027-02 includes a royalty-free BLE stack compatible with Bluetooth® 5.0 in a 9.0 × 9.0 × 1.75 mm SMT package form-factor, with a PCB Trace antenna.

CYBT-243053-02

Infineon’s AIROC™ CYBT-243053-02 is a fully certified Bluetooth® and Bluetooth® LE module based on Infineon’s CYW20820. This embedded module is available as a 35-ball package in 12x16.61x1.7mm SMT form-factor. Infineon’s AIROC™ CYBT-243053-02 module complies with Bluetooth® Core 5.4 and has gone through the requisite qualification with a Declaration ID D051681 and QDID 156667.