ringi (16) » Noty katalogowe | elecena.pl - wyszukiwarka elementów elektronicznych

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HC55185AIMZ

VoIP Ringing SLIC

Producent:: Renesas Electronics
Rozmiar:: 1008 kB
Stron:: 20

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ISL5585

3.3 Volt Ringing SLIC Family for Voice Over Broadband (VOB)

Producent:: Renesas Electronics
Rozmiar:: 995 kB
Stron:: 23

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HC55184ECMZ

Extended Reach Ringing SLIC Family

Producent:: Renesas Electronics
Rozmiar:: 912 kB
Stron:: 19

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TLE9371VLE

Infineon’s TLE937x family with up to 8MB/s flexible data rate The CAN Signal Improvement transceivers enhance signal integrity, reduce ringing effects, and enable faster bit rates. They offer highly accurate transmitter, reduced ringing, increased CAN speed, improved EMC performance, and full CAN FD protocol operations. These transceivers facilitate more node connections, entry into complex applications, reduced cable weight and costs, and find potential use in gateway modules and body control modules.

Producent:: Infineon
Rozmiar:: 639 kB
Stron:: 38

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ISL5586

Low Power Ringing SLIC for Home Gateways

Producent:: Intersil
Rozmiar:: 605 kB
Stron:: 1

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HC55185

VoIP Ringing SLIC

Producent:: Intersil
Rozmiar:: 564 kB
Stron:: 1

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HC55182

Extended Reach Ringing SLIC Family

Producent:: Intersil
Rozmiar:: 460 kB
Stron:: 1

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ISL5585

3.3 Volt Ringing SLIC Family for Voice Over Broadband (VOB)

Producent:: Intersil
Rozmiar:: 460 kB
Stron:: 1

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TDM22544D

TDM22544D Dual Phase 140 A OptiMOS™ Power Module The dual OptiMOS™ 6 power module co-packages two smart power stages, two power inductors, and decoupling capacitors to implement two independent synchronous buck converters into a small 10x9x8 mm package. The package is optimized for PCB layout, heat transfer, driver/MOSFET control timing, and minimal switch node ringing.

Producent:: Infineon
Rozmiar:: 321 kB
Stron:: 8

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TDM22545D

TDM22545D Dual Phase 140 A OptiMOS™ Power Module The dual OptiMOS™ power module co-packages two smart power stages, two power inductors, and decoupling capacitors to implement two independent synchronous buck converters into a small 10x9x5 mm package. The package is optimized for PCB layout, heat transfer, driver/MOSFET control timing, and minimal switch node ringing. Additionally, the 5 mm height makes the module ideal for bottom-side mounting.