CDHV Thick Film Chip Dividers, High Voltage

* oHigh voltage up to 3000 V

* oTypical resistance ratios of 250:1 to a maximum resistance ratio of 500:1

* oFlow solderable

* oTape and reel packaging available

* oTermination style: 3-sided wraparound termination or single termination flip chip available

* oSuitable for solderable, epoxy bondable, or wire bondable applications

* oTermination material: solder-coated nickel barrier or solder coated non-magnetic terminations standard; gold, palladium silver, platinum gold, platinum silver or platinum palladium gold terminations available

* oMultiple styles, termination materials and configurations, allow wide design flexibility

* oEpoxy bondable or wire bondable non-magnetic terminations available

* o

* oStandard solder plating for the nickel barrier and non-magnetic parts is solder terminations E or T. Hot solder dipped terminations F or S are also available

* oUse solder termination N for applications requiring epoxy bondable mounting, and solder terminations F or S for applications requiring solderable mounting

* oWhile not recommended, palladium silver terminations could be used for solderable applications when using a solder alloy containing silver. If the solder paste being used to solder the palladium silver terminated parts to the boards does not have a silver-based composition, then the silver in the terminations could begin to leach when it is exposed to liquidus non-silver-based solders, causing the potential for solderability and/or solder joint issues