RC Thick Film Chip Resistors, Alternate Terminations

* oSuitable for solderable, epoxy bondable, or wire bondable applications

* oTermination material: gold, platinum silver, platinum palladium gold or solder coated non-magnetic terminations available

* oMultiple styles, termination materials and configurations, allow wide design flexibility

* oEpoxy bondable or wire bondable non-magnetic terminations available

* oFlow solderable

* oCustom sizes available

* oBurn-in data available

* oAutomatic placement capability

* oTermination style: 3-sided wraparound termination or single termination flip chip standard; 5-sided wraparound termination available

* oTape and reel packaging available

* oInternationally standardized sizes

* o

* oStandard solder plating for the non-magnetic parts are solder terminations E or T. Hot solder dipped terminations F or S are also available.

* oUse solder termination N for applications requiring epoxy bondable mounting, and solder terminations F or S for applications requiring solderable mounting.

* oWhile not recommended, palladium silver terminations could be used for solderable applications when using a solder alloy containing silver. If the solder paste being used to solder the palladium silver terminated parts to the boards does not have a silver-based composition, then the silver in the terminations could begin to leach when it is exposed to liquidus non-silver-based solders, causing the potential for solderability and/or solder joint issues.