Solder Wire Sn99.3Cu0.7 1.1.3/3.0% Ø0.50 100g

Lead-free solder wire with flux, universal use in electronics and electrical engineering.

Alloy designation according to ISO 9453: 2014:

Sn99.3Cu0.7 (401)

Product form: wire with flux

Name of the flux: 1.1.3

General characteristics

The Sn99.3Cu0.7 solder tin with 1.1.3 flux was produced in the first smelting of tin and copper in accordance with EN ISO 9453: 2014. The halogen-free, rosin-free flux 1.1.3 is intended for manual and automatic soft soldering. The binder with flux meets the requirements of the RoHS2 directive.

Alloy composition [%]

Sn - rest

Cu - 0.5 - 0.9

Bi - max 0.1

Sb - max 0.1

Ag - max 0.1

Cd - max 0.002

Au - max 0.05

In - max 0.1

Pb - max 0.07

Al - max 0.001

As - max 0.03

Fe - max 0.02

Ni - max 0.01

Zn - max 0.001

Physical Characteristics

Melting point (solidus / liquidus) 227 ° C

Specific gravity 7.31 g / cm3

Resistivity 0.126 μΩ • m

Thermal conductivity 66 W / m • K

Tensile strength at break 300 kgf / cm2

Elongation at break 21%

Hardness 9 HB

Recommended soldering tip temperature 340 - 420°C

1.1.3 Flux

designation according to DIN 8511: SW32

designation according to ISO 9454: 1.1.3B

designation according to J-STD-004: ROM0

Flux content: 3.0 +/- 0.2%

Halogen content: 0.0%

Acid value: 195 ± 10 mg KOH / g

Corrosivity: non-corrosive

Manufacturer: Cynel Unipress

Manufactured in Poland