Solder Wire Sn99Cu0.7Ag0.3 1.1.3/3.0% Ø0.50 100g

Low-silver (LOW-SAC) lead-free solder wire for soldering applications in soldering units.

Alloy designation according to ISO 9453: 2014:

Sn99Cu0.7Ag0.3 (501)

Product form: wire with flux

Name of the flux: 1.1.3

General characteristics

The Sn99Cu0.7Ag0.3 solder wire with 1.1.3 flux was produced in the first smelting of tin, copper and silver in accordance with EN ISO 9453: 2014. The halogen-free, rosin-free flux 1.1.3 is intended for manual and automatic soft soldering. The low-silver binder is intended for professional mechanized soldering in electronics, where compliance with the RoHS2 directive is required.

Alloy composition [%]

Sn - rest

Ag - 0.20 - 0.40

Cu - 0.50 - 0.90

Bi - max 0.06

Sb - max 0.10

Cd - max 0.002

Au - max 0.05

In - max 0.10

Pb - max 0.07

Al - max 0.001

As - max 0.03

Fe - max 0.02

Ni - max 0.01

Zn - max 0.001

Physical Characteristics

Melting point (solidus / liquidus) 217/227 ° C

Specific gravity 7.33 g / cm3

Resistivity -

Thermal conductivity -

Tensile strength at break 300 kgf / cm2

Elongation at break 22%

Hardness 14 HB

Recommended soldering tip temperature 340 - 420 ° C

1.1.3 Flux

designation according to DIN 8511: SW32

designation according to ISO 9454: 1.1.3B

designation according to J-STD-004: ROM0

Flux content: 3.0 +/- 0.2% others to be agreed

Halogen content: 0.0%

Acid value: 195 ± 10 mg KOH / g

Corrosivity: non-corrosive

Manufacturer: Cynel Unipress

Manufactured in Poland